Michitaka Yamamoto

Comparison of Argon and Oxygen Plasma Treatments for Ambient Room-Temperature Wafer-Scale Au–Au Bonding Using Ultrathin Au Films

Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima et al. · Micromachines · 2019 · 72 citations · Full text

Materials Engineering, Materials Science, Surface Characterization +12

Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding

Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima et al. · Micromachines · 2020 · 40 citations · Full text

Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration

Eiji Higurashi, Michitaka Yamamoto, Takeshi Sato et al. · IEICE Transactions on Electronics · 2016 · 29 citations · Full text

Optical Materials, Engineering, Optoelectronic Device Integration +20

Plastic-scale-model assembly of ultrathin film MEMS piezoresistive strain sensor with conventional vacuum-suction chip mounter

Seiichi Takamatsu, Shintaro Goto, Michitaka Yamamoto et al. · Scientific Reports · 2019 · 19 citations · Full text

Properties of various plasma surface treatments for low-temperature Au–Au bonding

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga et al. · Japanese Journal of Applied Physics · 2018 · 18 citations

Materials Science, Materials Engineering, Chemical Engineering +14