Nikhilendu Tiwary

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Obert Golim, Vesa Vuorinen, Glenn Ross et al. · Scripta Materialia · 2022 · 23 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen et al. · IEEE Transactions on Electron Devices · 2022 · 21 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +16

Low Cost, Large Area, Flexible Graphene Nanocomposite Films for Energy Harvesting Applications

Manoj Kandpal, Vijay Palaparthy, Nikhilendu Tiwary et al. · IEEE Transactions on Nanotechnology · 2017 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +16

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 14 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Flame retardation of polypropylene: Effect of silane treated antimony compounds

Ν. K. Jha, Ashish Misra, Nikhilendu Tiwary et al. · Polymer Engineering and Science · 1985 · 13 citations

Engineering, Materials Engineering, Materials Science +17