Fengshun Wu

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Publications

Citations

114

H-Index

Active since

2008

Affiliations

Huazhong University of Science and Technology(Current)

Wuhan National Laboratory for Optoelectronics

Fengshun Wu is an author at Huazhong University of Science and Technology specializing in metallic materials, materials science, and materials engineering.

ORCID

Publications per year

2008–2023

Publications

Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints

Tianwei Hu, Yi Li, Yan‐Cheong Chan et al. · Microelectronics Reliability · 2015 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +13

Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis

Guang Yang, Ee Lynn Lee, Kai Yang et al. · Journal of Electronic Materials · 2023 · 18 citations

Engineering, Materials Engineering, Materials Science +16

Effect of stand‐off height on the microstructure and mechanical behaviour of solder joints

Bo Wang, Fengshun Wu, Yiping Wu et al. · Soldering and Surface Mount Technology · 2010 · 17 citations

Natural Sciences, Materials Engineering, Materials Science +17

Research on the contact resistance and reliability of flexible RFID tag inlays packaged by anisotropic conductive paste

Xionghui Cai, Bing An, Yiping Wu et al. · 2008 · 17 citations

Engineering, Materials Engineering, Materials Science +17

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