Zeyu Sun

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method

Chase Cook, Zeyu Sun, Ertugrul Demircan et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2018 · 52 citations

Numerical Analysis, Engineering, Computational Mechanics +17

Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited)

Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim et al. · Integration · 2017 · 45 citations

Reliability, Electrical Engineering, Reliability Engineering +13

Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires

Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2018 · 38 citations

Electrical Engineering, Electromigration Technique, Engineering +11

Voltage-based electromigration immortality check for general multi-branch interconnects

Zeyu Sun, Ertugrul Demircan, Mehul D. Shrof et al. · 2016 · 37 citations · Full text

Engineering, Current Density, Power Electronics +16

EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation

Zeyu Sun, Shuyuan Yu, Han Zhou et al. · IEEE Transactions on Device and Materials Reliability · 2020 · 36 citations

Electrohydrodynamics, Engineering, Em Simulator +20