C. Filloy

Back side thermal imaging of integrated circuits at high spatial resolution

Gilles Tessier, Mathieu Bardoux, C. Boué et al. · Applied Physics Letters · 2007 · 60 citations

Engineering, Microscopy, Integrated Circuits +27

Measuring and predicting the thermoreflectance sensitivity as a function of wavelength on encapsulated materials

Gilles Tessier, G. Jérosolimski, Stéphane Holé et al. · Review of Scientific Instruments · 2003 · 55 citations

Optical Materials, Engineering, Microscopy +30

Thermoreflectance temperature imaging of integrated circuits: calibration technique and quantitative comparison with integrated sensors and simulations

Gilles Tessier, M. L. Polignano, S. Pavageau et al. · Journal of Physics D Applied Physics · 2006 · 42 citations

Engineering, Microscopy, Integrated Circuits +24

Quantitative Thermoreflectance Imaging: Calibration Method and Validation on a Dedicated Integrated Circuit

Gilles Tessier, S. Pavageau, Benoît Charlot et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 28 citations

Engineering, Microscopy, Reflectance Variations +25

High resolution thermal imaging inside integrated circuits

Gilles Tessier, Mathieu Bardoux, C. Filloy et al. · Sensor Review · 2007 · 20 citations

Optical Materials, Engineering, High Resolution +25