C. Boué

Back side thermal imaging of integrated circuits at high spatial resolution

Gilles Tessier, Mathieu Bardoux, C. Boué et al. · Applied Physics Letters · 2007 · 60 citations

Engineering, Microscopy, Integrated Circuits +27

Determination of an HCF criterion by thermal measurements under biaxial cyclic loading

Cédric Doudard, Martin Poncelet, Sylvain Calloch et al. · International Journal of Fatigue · 2006 · 53 citations · Full text

Materials Science, Engineering, Mechanical Engineering +6

Infrared thermography protocol for simple measurements of thermal diffusivity and conductivity

C. Boué, Stéphane Holé · Infrared Physics & Technology · 2012 · 48 citations

Engineering, Simple Measurements, Thermal Diffusivity +16

Infrared Lock-in Thermography Crack Localization on Metallic Surfaces for Industrial Diagnosis

Yasmina Fedala, M. Streza, F. Sepúlveda et al. · Journal of Nondestructive Evaluation · 2013 · 39 citations

Engineering, Thermography, High Temperature Materials +11

Polarization of thick polyvinylidene fluoride/trifluoroethylene copolymer films

H. L. W. Chan, Zejia Zhao, K. W. Kwok et al. · Journal of Applied Physics · 1996 · 38 citations · Full text

Materials Science, Conducting Polymer, Block Co-polymers +9