Concepedia

Yoshihiko Kanda

YK

Statistics

Publications

6

Citations

119

H-Index

6

Active since

2008

Affiliations

Shibaura Institute of Technology(Current)

Yoshihiko Kanda is an author at Shibaura Institute of Technology specializing in materials engineering, natural sciences, and materials science.

Publications per year

2008–2022

6

Publications

6

Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test

Yoshihiko Kanda, Yoshiharu Kariya · Microelectronics Reliability · 2012 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +13

Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

Yoshihiko Kanda, Yoshiharu Kariya, Yuji Oto · Journal of Electronic Materials · 2011 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint

Yoshihiko Kanda, Yoshiharu Kariya, Yusuke Mochizuki · MATERIALS TRANSACTIONS · 2008 · 15 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Class I Creep Deformation of Sn–Ag–Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints

Masaki Moriuchi, Yoshiharu Kariya, Mao Kondo et al. · MATERIALS TRANSACTIONS · 2022 · 15 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

Yoshihiko Kanda, Yoshiharu Kariya · Journal of Electronic Materials · 2009 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +12

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