G. Dixit

The effect of interconnect scaling and low-k dielectric on the thermal characteristics of the IC metal

Kaustav Banerjee, A. Amerasekera, G. Dixit et al. · 2002 · 73 citations

Engineering, Electrical Engineering, Materials Science +17

Planarization of Copper Thin Films by Electropolishing in Phosphoric Acid for ULSI Applications

Deenesh Padhi, J. Yahalom, S. Gandikota et al. · Journal of The Electrochemical Society · 2002 · 60 citations

Natural Sciences, Materials Engineering, Materials Science +16

Sub-100 nm gate length metal gate NMOS transistors fabricated by a replacement gate process

Amitava Chatterjee, R. A. Chapman, G. Dixit et al. · 2002 · 56 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization of contact and via failure under short duration high pulsed current stress

Kaustav Banerjee, A. Amerasekera, G. Dixit et al. · 2002 · 30 citations

Engineering, Electrical Engineering, Materials Science +17

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

G. A. Antonelli, Gengwei Jiang, Roey Shaviv et al. · Microelectronic Engineering · 2011 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +16