Shengju Huang

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Active since

2021

Affiliations

University of Shanghai for Science and Technology(Current)

Shengju Huang is an author at University of Shanghai for Science and Technology specializing in silicon materials, materials science, and engineering.

Publications per year

2021–2022

Publications

Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing

Yan Wang, Bocheng Zhao, Shengju Huang et al. · Engineering Fracture Mechanics · 2021 · 31 citations

Engineering, Materials Engineering, Materials Science +13

Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw

Yan Wang, Shengju Huang, Zhaofeng Qian et al. · Engineering Fracture Mechanics · 2022 · 23 citations

Engineering, Materials Engineering, Materials Science +13

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