Study on the subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted diamond wire sawing

Elastic/Plastic Indentation Damage in Ceramics: The Median/Radial Crack System

Brian R. Lawn, A.G. Evans, D. B. Marshall · Journal of the American Ceramic Society · 1980 · 2.1K citations

Engineering, Materials Engineering, Materials Science +17

Basic Mechanisms and Models of Multi‐Wire Sawing

H.J. Möller · Advanced Engineering Materials · 2004 · 216 citations

Engineering, Manufacturing Engineering, Materials Science +16

Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing

Arkadeep Kumar, Shreyes N. Melkote · Procedia Manufacturing · 2018 · 147 citations · Full text

Engineering, Manufacturing Engineering, Materials Science +17

Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed‐abrasive wire

N. Watanabe, Y. Kondo, Daisuke Ide et al. · Progress in Photovoltaics Research and Applications · 2010 · 114 citations

Engineering, Materials Engineering, Materials Science +17

Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers

Arkadeep Kumar, Steffi Kaminski, Shreyes N. Melkote et al. · Wear · 2016 · 105 citations

Engineering, Materials Engineering, Materials Science +14