Ajay Balankutty

Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices

D. Ingerly, Sally Safwat Amin, L. Aryasomayajula et al. · 2019 · 154 citations

Engineering, Computer Engineering, Embedded Systems +16

A 0.6-V Zero-IF/Low-IF Receiver With Integrated Fractional-N Synthesizer for 2.4-GHz ISM-Band Applications

Ajay Balankutty, Shih-An Yu, Yiping Feng et al. · IEEE Journal of Solid-State Circuits · 2010 · 112 citations

Engineering, Electrical Engineering, Analog Electronics +16

3.5 A 16-to-40Gb/s quarter-rate NRZ/PAM4 dual-mode transmitter in 14nm CMOS

Jihwan Kim, Ajay Balankutty, Amr Elshazly et al. · 2015 · 102 citations

Engineering, Communication, Electrical Engineering +16

8.1 Lakefield and Mobility Compute: A 3D Stacked 10nm and 22FFL Hybrid Processor System in 12×12mm², 1mm Package-on-Package

Wilfred Gomes, Sanjeev Khushu, D. Ingerly et al. · 2020 · 91 citations

Engineering, Computer Engineering, Computer Science +17

A 1.41pJ/b 224Gb/s PAM-4 SerDes Receiver with 31dB Loss Compensation

Yoav Segal, Amir Laufer, Ahmad Khairi et al. · 2022 IEEE International Solid- State Circuits Conference (ISSCC) · 2022 · 91 citations

Engineering, Computer Engineering, Electrical Engineering +17