Multipurpose sensor tips for scanning near-field microscopy

Ch. Mihalcea, W. Scholz, S. Werner, +3

Applied Physics Letters

EngineeringMicroscopyMechanical EngineeringMultipurpose Sensor TipsBiomedical Engineering +16

Theoretical and experimental analysis of a partially textured thrust bearing with square dimples

V G Marian, Martin Kilian, W. Scholz

Proceedings of the Institution of Mechanical Engineers Part J Journal of Engineering Tribology

Tribological CoatingEngineeringHydrodynamic LubricationAerospace EngineeringMechanics +12

Fabrication of integrated diamond cantilevers with tips for SPM applications

W. Kulisch, A. Malavé, G. Lippold, +3

Diamond and Related Materials

Materials ScienceDiamond-like CarbonEngineeringMicrofabricationSpm Applications +4

Thermal imaging of thin films by scanning thermal microscope

E. Oesterschulze, M. Stopka, Lars Ackermann, +2

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

EngineeringMicroscopyThermal ConductivityOptical PropertiesThermal Microscope +17

Fabrication of small diamond tips for scanning probe microscopy application

E. Oesterschulze, W. Scholz, Ch. Mihalcea, +3

Applied Physics Letters

EngineeringMicroscopyMechanical EngineeringDiamond NucleationWafer Scale Processing +17

Cantilever probes for SNOM applications with single and double aperture tips

E. Oesterschulze, O. Rudow, C. Mihalcea, +2

Ultramicroscopy

Electronic InstrumentationEngineeringPhysicsMicroscopyOptical Properties +8

Novel micromachined cantilever sensors for scanning near‐field optical microscopy

Stefan Münster, S. Werner, C. Mihalcea, +2

Journal of Microscopy

EngineeringMicroscopyMicromachinesHollow Metal PyramidMicroscopy Method +19

Fabrication of monolithic diamond probes for scanning probe microscopy applications

C. Mihalcea, W. Scholz, A. Malavé, +3

Applied Physics A

Materials ScienceDiamond-like CarbonEngineeringMonolithic Diamond ProbesBiomedical Diagnostics +9

Optimized flip-chip interconnect for 38 GHz thin-film microstrip multichip modules

Ngoc-Hoa Huynh, W. Heinrich, K. Hirche, +3

Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On Board +12

GaAs FET characterization in a quasi-monolithic Si environment

Edward Wasige, G. Kompa, F. van Raay, +5

Electrical EngineeringSemiconductor DeviceEngineeringRf SemiconductorNanoelectronics +12