Y.Y. Wang

Publications

Citations

H-Index

2005

Active since

Affiliations

Institute of High Performance Computing(Current)

Y.Y. Wang is an author at Institute of High Performance Computing specializing in mechanical engineering, structural mechanics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsComputer EngineeringElectronic PackagingStructural MechanicsMechanical EngineeringMechanics Of MaterialsStructural EngineeringReliability EngineeringReliability

Publications per year

2005–2005

Publications

Board level drop test reliability of IC packages

T.C. Chai, Ser Tong Quek, Wai Yin Hnin et al. · 2005 · 41 citations

Engineering, Board Design, Impact Loading +21

Finite element modeling of CSP package subjected to board level drop test

Y.Y. Wang, F. Wang, T.C. Chai · 2005 · 16 citations

Engineering, Finite Element Modeling, Mechanical Engineering +20

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