A. Juritza

Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation

H. Albrecht, A. Juritza, K.‐N. Müller et al. · 2004 · 42 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mechanical testing of antimicrobial biocomposite coating on metallic medical implants as drug delivery system

Ipek Karacan, Besim Ben‐Nissan, Hang Andy Wang et al. · Materials Science and Engineering C · 2019 · 37 citations · Full text

Natural Sciences, Biomedical Engineering, Materials Engineering +17

Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?

H. Albrecht, T. Hannach, Akira Hase et al. · Archive of Applied Mechanics · 2005 · 34 citations

Natural Sciences, Materials Engineering, Materials Science +16

Weibull statistics of silicon die fracture

Christoph Böhm, T. Hauck, A. Juritza et al. · 2005 · 24 citations

Engineering, Materials Engineering, Materials Science +17

Probability of silicon fracture in molded packages [ICs]

Christoph Böhm, T. Hauck, Wolfgang H. Müller et al. · 2004 · 18 citations

Engineering, Materials Engineering, Materials Science +17