Interface reactions in microelectronic solder joints and associated intermetallic compounds: an investigation of their mechanical properties using nanoindentation

Abstract

In this paper we present our results on how nanoindentation can serve for measurement of (local) mechanical properties in microelectronic materials and components. Special attention is paid to the properties of interface regions, i.e., the region of intermetallic bonds. Finally a finite element model is presented in order to simulate the full indentation process.