Zhizhao Huang

An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications

Cai Chen, Yu Chen, Yuxiong Li et al. · IEEE Transactions on Industrial Electronics · 2017 · 96 citations

Advanced Packaging, Electrical Engineering, Sic Devices +13

Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure

Cai Chen, Zhizhao Huang, Lichuan Chen et al. · IEEE Transactions on Power Electronics · 2018 · 76 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +13

A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure

Zhizhao Huang, Cai Chen, Yue Xie et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 59 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +10

High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-Based High Frequency Converter

Yue Xie, Cai Chen, Zhizhao Huang et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 52 citations

Engineering, Power Electronics Converter, Silicon Carbide +16

Investigation on Ultralow Turn-off Losses Phenomenon for SiC MOSFETs With Improved Switching Model

Yue Xie, Cai Chen, Yiyang Yan et al. · IEEE Transactions on Power Electronics · 2021 · 47 citations

Device Modeling, Sic Mosfet, Electrical Engineering +11