Raleigh Estrada

3D X-Ray microscopy: A non destructive high resolution imaging technology that replaces physical cross-sectioning for 3DIC packaging

Yuri Sylvester, Bruce Johnson, Raleigh Estrada et al. · 2013 · 18 citations

Engineering, Microscopy, Physical Cross-sectioning +24

Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

M. Cason, Raleigh Estrada · 2011 · 13 citations

Engineering, Mechanics Of Materials, Non-destructive Failure Analysis +20

Applications of 3D X-Ray Microscopy for Advanced Package Development

K Fahey, Raleigh Estrada, Laura Mirkarimi et al. · IMAPSource Proceedings · 2011 · 12 citations · Full text

Engineering, Microscopy, Flip Chip Package +18

3D X-ray microscopy: A near-SEM non-destructive imaging technology used in the development of 3D IC packaging

Yuri Sylvester, Luke Hunter, Bruce Johnson et al. · 2013 · 11 citations

Engineering, Microscopy, Physical Cross-section +26