Concepedia

Peter Kruppa

PK

Statistics

Publications

2

Citations

25

H-Index

2

Active since

1994

Affiliations

Technische Universität Berlin(Current)

Peter Kruppa is an author at Technische Universität Berlin specializing in wafer bonding, materials engineering, and contact reliability.

Publications per year

1994–2005

2

Publications

2

Investigations of tab outer lead contacts performed by thermode gang bonding and laser single point bonding

E. Zakel, G. Azdasht, Peter Kruppa et al. · 2005 · 13 citations

, , +15

Reliability investigations of different tape metallizations for TAB-outer lead bonding

E. Zakel, G. Azdasht, Peter Kruppa et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · 12 citations

, , +14

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