R. Quon

Future on-chip interconnect metallization and electromigration

Chunhua Hu, James J. Kelly, Huai Huang et al. · 2018 · 69 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Impact of Humidity on Adhesion between Rough Surfaces

R. Quon, A. Ulman, T. Kyle Vanderlick · Langmuir · 2000 · 39 citations

Materials Science, Self-cleaning Surface, Chemical Engineering +11

Cobalt interconnect on same copper barrier process integration at the 7nm node

Frank W. Mont, Xunyuan Zhang, Wei Wang et al. · 2017 · 39 citations

Engineering, Interconnect (Integrated Circuits), Dielectric Films +16

Direct Force Measurements at the Smooth Gold/Mica Interface

R. F. Knarr, R. Quon, T. Kyle Vanderlick · Langmuir · 1998 · 36 citations

Engineering, Mechanical Engineering, Surface Nanotechnology +21

Measurement of the Deformation and Adhesion of Rough Solids in Contact

R. Quon, R. F. Knarr, T. Kyle Vanderlick · The Journal of Physical Chemistry B · 1999 · 31 citations

Engineering, Mechanical Engineering, Contact Mechanics Approach +19