Concepedia

Chuanjun Nie

CN

Statistics

Publications

4

Citations

110

H-Index

4

Active since

2022

Affiliations

University of Chinese Academy of Sciences(Current)

Chinese Academy of Sciences

Institute of Microelectronics

Chuanjun Nie is an author at University of Chinese Academy of Sciences specializing in heat transfer, thermal design, and heat conduction.

Publications per year

2022–2023

4

Publications

4

Efficient transient thermal analysis of chiplet heterogeneous integration

Chuanjun Nie, Qinzhi Xu, Chenghan Wang et al. · Applied Thermal Engineering · 2023 · 30 citations

Engineering, Mechanical Engineering, Heat Transfer +13

Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits

Chuanjun Nie, Qinzhi Xu, Lan Chen · Microelectronics Reliability · 2022 · 29 citations

Engineering, Computer Engineering, Electrical Engineering +16

An efficient thermal model of chiplet heterogeneous integration system for steady-state temperature prediction

Chenghan Wang, Qinzhi Xu, Chuanjun Nie et al. · Microelectronics Reliability · 2023 · 26 citations

Engineering, Computational Engineering, Mechanical Engineering +16

A Multiscale Anisotropic Thermal Model of Chiplet Heterogeneous Integration System

Chenghan Wang, Qinzhi Xu, Chuanjun Nie et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2023 · 25 citations

Engineering, Computer Engineering, Mechanical Engineering +17

1–4 of 4