Kong‐Boon Yeap

Publications

Citations

H-Index

2012

Active since

Affiliations

Fraunhofer Institute for Nondestructive Testing(Current)

Kong‐Boon Yeap is an author at Fraunhofer Institute for Nondestructive Testing specializing in applied physics, electronic packaging, and electrical engineering.

Top concepts

EngineeringApplied PhysicsNanoelectronicsMicroelectronicsElectronic PackagingElectrical EngineeringPhysicsMicrostructureThermodynamicsSolid Mechanics

Publications per year

2012–2013

Publications

Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

Meike Hauschildt, C. Hennesthal, G. Talut et al. · 2013 · 50 citations

Engineering, Early Failure Population, Growth Phenomena +16

Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias

Aditya P. Karmarkar, Xiaopeng Xu, Kong‐Boon Yeap et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 19 citations

Elastic Anisotropy, Engineering, Mechanical Engineering +18

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