Concepedia

Robert Lanzone

RL

Statistics

Publications

2

Citations

164

H-Index

2

Active since

2009

Affiliations

Amkor Technology (United States)(Current)

Robert Lanzone is an author at Amkor Technology (United States) specializing in engineering, integrated circuit fabrication, and chip packaging.

Publications per year

2009–2011

2

Publications

2

Next generation fine pitch Cu Pillar technology — Enabling next generation silicon nodes

M. Gerber, C. Beddingfield, Shawn O’Connor et al. · 2011 · 101 citations

, , +17

Study of interconnection process for fine pitch flip chip

Minjae Lee, Min Seok Yoo, J. Cho et al. · 2009 · 63 citations

, , +16

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