Hsin-Cheng Lin

Thermal resistance modeling of back-end interconnect and intrinsic FinFETs, and transient simulation of inverters with capacitive loading effects

Jhih-Yang Yan, Sun-Rong Jan, Yu-Jiun Peng et al. · 2016 · 39 citations

Engineering, Electrical Engineering, Heat Transfer +16

RF Performance of Stacked Si Nanosheet nFETs

Hsin-Cheng Lin, Tao Chou, Chia-Che Chung et al. · IEEE Transactions on Electron Devices · 2021 · 28 citations

Engineering, Electrical Engineering, Microelectronics +16

Structural and luminescence properties of tunable white-emitting Sr_0.5Ca_0.5Al₂O₄:Eu²⁺, Dy³⁺for UV-excited white-LEDs

Subrata Das, Che‐Yuan Yang, Hsin-Cheng Lin et al. · RSC Advances · 2014 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermal SPICE Modeling of FinFET and BEOL Considering Frequency-Dependent Transient Response, 3-D Heat Flow, Boundary/Alloy Scattering, and Interfacial Thermal Resistance

Chia-Che Chung, Hsin-Cheng Lin, Min-Fong Yang et al. · IEEE Transactions on Electron Devices · 2019 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

Self-Heating Induced Interchannel V_t Difference of Vertically Stacked Si Nanosheet Gate-All-Around MOSFETs

Chia-Che Chung, Hung-Yu Ye, Hsin-Cheng Lin et al. · IEEE Electron Device Letters · 2019 · 17 citations

Engineering, Electrical Engineering, Materials Science +17