Bruce C. Kim

Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding

Saikat Mondal, Sang‐Bock Cho, Bruce C. Kim · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2016 · 49 citations

Engineering, Ground Tsv, Crosstalk Evaluation +16

Development of novel carbon nanotube TSV technology

Anurag Gupta, Sukeshwar Kannan, Bruce C. Kim et al. · 2010 · 30 citations

Engineering, Interconnect (Integrated Circuits), Carbon-based Material +20

Analysis of carbon nanotube based Through Silicon Vias

Sukeshwar Kannan, Anurag Gupta, Bruce C. Kim et al. · 2010 · 28 citations

Materials Science, Graphene Nanomeshes, Electrical Engineering +15

Analysis of CNT based 3D TSV for emerging RF applications

Anurag Gupta, Bruce C. Kim, Sukeshwar Kannan et al. · 2011 · 21 citations

3D Ic Architecture, Electrical Engineering, Rf Applications +14

Low-Cost Testing of 5 GHz Low Noise Amplifiers Using New RF BIST Circuit

Jee-Youl Ryu, Bruce C. Kim · Journal of Electronic Testing · 2005 · 17 citations

Engineering, Rf Semiconductor, Radio Frequency +5