Dong‐Hyuk Lim

UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Young‐Jun Park, Dong‐Hyuk Lim, Hyun‐Joong Kim et al. · International Journal of Adhesion and Adhesives · 2009 · 212 citations

Natural Sciences, Materials Engineering, Materials Science +16

PSA performances and viscoelastic properties of SIS‐based PSA blends with H‐DCPD tackifiers

Dong‐Hyuk Lim, Hyun‐Sung Do, Hyun‐Joong Kim · Journal of Applied Polymer Science · 2006 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +17

A Reconfigurable 40-to-67 dB SNR, 50-to-6400 Hz Frame-Rate, Column-Parallel Readout IC for Capacitive Touch-Screen Panels

Jun-Eun Park, Dong‐Hyuk Lim, Deog‐Kyoon Jeong · IEEE Journal of Solid-State Circuits · 2014 · 60 citations

Engineering, Electrical Engineering, Analog Electronics +16

6.4 A 56Gb/s 7.7mW/Gb/s PAM-4 Wireline Transceiver in 10nm FinFET Using MM-CDR-Based ADC Timing Skew Control and Low-Power DSP with Approximate Multiplier

Byoung-Joo Yoo, Dong‐Hyuk Lim, Hyonguk Pang et al. · 2020 · 57 citations

Engineering, Computer Engineering, Electrical Engineering +15

UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process

Seung‐Woo Lee, Ji‐Won Park, Cho-Hee Park et al. · International Journal of Adhesion and Adhesives · 2013 · 53 citations

Engineering, Materials Engineering, Materials Science +17