Dong‐Hyuk Lim

UV- and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers

Young‐Jun Park, Dong‐Hyuk Lim, Hyun‐Joong Kim et al. · International Journal of Adhesion and Adhesives · 2009 · 207 citations

Materials Science, Engineering, Polymer Technology +10

A Reconfigurable 40-to-67 dB SNR, 50-to-6400 Hz Frame-Rate, Column-Parallel Readout IC for Capacitive Touch-Screen Panels

Jun-Eun Park, Dong‐Hyuk Lim, Deog‐Kyoon Jeong · IEEE Journal of Solid-State Circuits · 2014 · 59 citations

Engineering, Capacitive Touch-screen Panels, Touch User Interface +10

PSA performances and viscoelastic properties of SIS‐based PSA blends with H‐DCPD tackifiers

Dong‐Hyuk Lim, Hyun‐Sung Do, Hyun‐Joong Kim · Journal of Applied Polymer Science · 2006 · 57 citations

Engineering, Mechanical Engineering, Thermoplastic Composite +19

6.4 A 56Gb/s 7.7mW/Gb/s PAM-4 Wireline Transceiver in 10nm FinFET Using MM-CDR-Based ADC Timing Skew Control and Low-Power DSP with Approximate Multiplier

Byoung-Joo Yoo, Dong‐Hyuk Lim, Hyonguk Pang et al. · 2020 · 55 citations

Engineering, Low-power Dsp, Data Converter +12

UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process

Seung‐Woo Lee, Ji‐Won Park, Cho-Hee Park et al. · International Journal of Adhesion and Adhesives · 2013 · 51 citations

Materials Science, Multi-chip Package Process, Engineering +11