Concepedia

Minyu Yan

MY

6

Publications

367

Citations

6

H-Index

2002

Active since

Affiliations

Semiconductor Manufacturing International (Italy)(Current)

Nanyang Technological University

Tsinghua University

Hodges University

University of California, Los Angeles

Minyu Yan is an author at Semiconductor Manufacturing International (Italy) specializing in materials science, engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceApplied PhysicsSurface ScienceMicroelectronicsElectronic PackagingElectrical InsulationMaterials EngineeringElectrical EngineeringNanomaterials

Publications per year

2002–2005

6

Publications

6

Preparation and characterization of nano-TiO2 powder

Bao-rang Li, Xiaohui Wang, Minyu Yan et al. · Materials Chemistry and Physics · 2002 · 252 citations

Materials Science, Engineering, Nanomaterials +3

Influence of grain size on distribution of temperature and thermal stress in ZnO varistor ceramics

Qingheng Chen, Jinliang He, Kexiong Tan et al. · Science China Technological Sciences · 2002 · 42 citations

Materials Science, Thermal Stress, Engineering +7

Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects

Minyu Yan, Jong-ook Suh, Fei Ren et al. · Applied Physics Letters · 2005 · 29 citations

Engineering, Cu Dual-damascene Interconnects, Electromigration Lifetime Improvement +17

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Ehrenfried Zschech, H. Engelmann, Moritz Andreas Meyer et al. · Zeitschrift für Metallkunde · 2005 · 22 citations

Engineering, Interconnect (Integrated Circuits), Advanced Packaging (Semiconductors) +17

Confinement of electromigration induced void propagation in Cu interconnect by a buried Ta diffusion barrier layer

Minyu Yan, K. N. Tu, A. V. Vairagar et al. · Applied Physics Letters · 2005 · 11 citations

Engineering, Void Migration, Charge Transport +18

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