F. Ishitsuka

A new packaging technology using micro-solder bumps for high-speed photoreceivers

H. Tsunetsugu, K. Katsura, Tsuyoshi Hayashi et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1992 · 24 citations

Engineering, Electrical Engineering, Materials Science +17

Dye-laser amplified, atomic absorption flame spectroscopy

Mitsuo Maeda, F. Ishitsuka, Y. Miyazoe · Optics Communications · 1975 · 21 citations

Natural Sciences, Chemistry, Physics +11

Quantitative detection of atomic absorption by intracavity dye-laser quenching

Mitsuo Maeda, F. Ishitsuka, Masato Matsumoto et al. · Applied Optics · 1977 · 20 citations

Natural Sciences, Physics, Atomic Physics +11

A compact full MMIC module for Ku-band phase-locked oscillators

Takashi Ohira, H. Kato, Koiti Araki et al. · IEEE Transactions on Microwave Theory and Techniques · 1989 · 20 citations

Engineering, Electrical Engineering, Microelectronics +16

Low-cost, high-performance package for a multi-chip MMIC module

F. Ishitsuka, Norio Sato · 10th Annual IEEE (GaAs IC) Symposium, Gallium Arsenide Integrated Circuit. Technical Digest 1988. · 2003 · 17 citations

Engineering, Electrical Engineering, Microelectronics +16