Dong-Ok Kwak

Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage

Do-Hyoung Kim, Sung-Jun Joo, Dong-Ok Kwak et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 39 citations

Engineering, Computational Engineering, Electrical Engineering +17

FCOB (Flip Chip on Board) reliability study for mobile applications

Se-Young Jang, Soon‐Min Hong, Min Young Park et al. · 2004 · 16 citations

Engineering, Materials Engineering, Materials Science +17

Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards

Dohyoung Kim, Sung-Jun Joo, Dong-Ok Kwak et al. · Journal of Micromechanics and Microengineering · 2015 · 16 citations

Natural Sciences, Materials Engineering, Materials Science +13

Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)

Sung-Jun Joo, Buhm Park, Do-Hyoung Kim et al. · Journal of Micromechanics and Microengineering · 2016 · 10 citations

Engineering, Materials Engineering, Materials Science +16