Albrecht Uhlig

High aspect ratio TSV copper filling with different seed layers

M. J. Wolf, Thomas Dretschkow, Bernhard Wunderle et al. · 2008 · 109 citations

Materials Science, Electrical Engineering, Different Seed Layers +10

Voltammetric multichannel measurements using silicon fabricated microelectrode arrays

Manfred Paeschke, Frank Dietrich, Albrecht Uhlig et al. · Electroanalysis · 1996 · 63 citations

Engineering, Analytical Microsystems, Biomedical Engineering +18

Highly sensitive heavy metal analysis on platinum‐ and gold‐ultramicroelectrode arrays

Albrecht Uhlig, Uwe Schnakemberg, R. Hintsche · Electroanalysis · 1997 · 48 citations

Engineering, Chemistry, Sensor Technology +22

Miniaturized Ion-Selective Chip Electrode for Sensor Application

Albrecht Uhlig, Ernö Lindner, Cristian Teutloff et al. · Analytical Chemistry · 1997 · 43 citations

Chip-array electrodes for simultaneous stripping analysis of trace metals

Albrecht Uhlig, Manfred Paeschke, Uwe Schnakenberg et al. · Sensors and Actuators B Chemical · 1995 · 32 citations

Chemical Engineering, Electrical Engineering, Engineering +7