Andrew C. Rudack

Manufacturing metrology for c-Si module reliability and durability Part III: Module manufacturing

Eric Schneller, Paul Brooker, Narendra Shiradkar et al. · Renewable and Sustainable Energy Reviews · 2016 · 88 citations · Full text

Reliability, Reliability Engineering, Engineering +10

Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias

Lingteng Kong, J. R. Lloyd, Kong Boon Yeap et al. · Journal of Applied Physics · 2011 · 51 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

Manufacturing metrology for c-Si module reliability and durability Part II: Cell manufacturing

Kristopher O. Davis, Marianne P. Rodgers, Giuseppe Scardera et al. · Renewable and Sustainable Energy Reviews · 2016 · 45 citations · Full text

Reliability, Reliability Engineering, Engineering +13

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

LayWai Kong, Andrew C. Rudack, P. J. Krueger et al. · Microelectronic Engineering · 2011 · 42 citations

Materials Science, 3D Ic Architecture, Various Temperatures +11

Manufacturing metrology for c-Si photovoltaic module reliability and durability, Part I: Feedstock, crystallization and wafering

Hubert Seigneur, Nahid Mohajeri, Paul Brooker et al. · Renewable and Sustainable Energy Reviews · 2016 · 40 citations · Full text

Electrical Engineering, Wafer Scale Processing, Engineering +8