Concepedia

LayWai Kong

LK

1

Publications

42

Citations

1

H-Index

2011

Active since

Affiliations

Fraunhofer-Gesellschaft(Current)

LayWai Kong is an author at Fraunhofer-Gesellschaft specializing in applied physics, 3d printing, and engineering.

Top concepts

Physics3D PrintingEngineeringApplied PhysicsMaterial ScienceMicroelectronicsNatural SciencesElectronic Packaging

Publications per year

2011–2011

1

Publications

1

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

LayWai Kong, Andrew C. Rudack, P. J. Krueger et al. · Microelectronic Engineering · 2011 · 42 citations

Materials Science, 3D Ic Architecture, Various Temperatures +11

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