Statistics
Publications
2
Citations
118
H-Index
2
Active since
2014
Affiliations
Yi-Che Lai is an author at Siliconware Precision Industries (Taiwan) specializing in fan-out wafer-level packaging, packaging design, and engineering.
Publications per year
2014–2014
2
2
Warpage characterization of panel Fan-out (P-FO) package
Hung‐wen Liu, Yiwei Liu, Jason Ji et al. · 2014 · 62 citations
1–2 of 2