Concepedia

Masahiro Tsuriya

MT

Statistics

Publications

5

Citations

64

H-Index

5

Active since

2003

Affiliations

Flex (United States)(Current)

Japan Aviation Electronics Industry (Japan)

Intel (Malaysia)

Masahiro Tsuriya is an author at Flex (United States) specializing in industrial engineering, software design, and industrial design.

Top concepts

Publications per year

2003–2017

5

Publications

5

Recent trends of package warpage and measurement metrologies

Wei Keat Loh, Ron Kulterman, Haley Fu et al. · 2016 · 16 citations

Recent trend of package warpage characteristic

Wei Keat Loh, Ron Kulterman, Tim Purdie et al. · 2015 · 14 citations

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Comparison of advanced package warpage measurement metrologies

Ron W. Kultcrman, Wei Keat Loh, Haley Fu et al. · 2016 · 12 citations

Pb-free plating for peripheral/leadframe packages

Yoshikuni Nakadaira, T. Matsuura, Masahiro Tsuriya et al. · Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing · 2003 · 11 citations

High-temperature Pb-free die attach material project phase 1: Survey result

Lim Sze Pei, Binghua Pan, Hongwen Zhang et al. · 2017 · 11 citations

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