Concepedia

T.-Y. Lee

TL

Statistics

Publications

2

Citations

58

H-Index

2

Active since

2000

Affiliations

Motorola (United States)(Current)

T.-Y. Lee is an author at Motorola (United States) specializing in heat transfer, engineering, and heat transfer modeling.

Publications per year

2000–2004

2

Publications

2

An investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool

T.-Y. Lee · IEEE Transactions on Components and Packaging Technologies · 2000 · 34 citations

Engineering, Computational Engineering, Mechanical Engineering +17

A Study of Electromigration in 3-D Flip Chip Solder Joint Using Numerical Simulation of Heat Flux and Current Density

T.-Y.T. Lee, T.-Y. Lee, K. N. Tu · IEEE Transactions on Components and Packaging Technologies · 2004 · 24 citations

Engineering, Electrical Engineering, Materials Science +17

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