Mariam Sadaka

Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking

Ionut Radu, Didier Landru, G. Gaudin et al. · 2010 · 29 citations

Engineering, Bonding Quality, Mechanical Engineering +17

EXTRACTION OF SHIKIMIC AND QUINIC ACIDS

Mariam Sadaka, Antonio Garcia · Chemical Engineering Communications · 1999 · 27 citations

Solvent Extraction, Oleic Acid, Engineering +12

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

G. Gaudin, G. Riou, Didier Landru et al. · 2010 · 17 citations

Engineering, Interconnect (Integrated Circuits), Surface Preparation +19

Performance of super-critical strained-si directly on insulator (SC-SSOI) CMOS based on high-performance PD-SOI technology

Aaron Thean, T. White, Mariam Sadaka et al. · 2005 · 17 citations

Semiconductor Technology, Electrical Engineering, Semiconductor Device +14

3D integration: Advantages, enabling technologies & applications

Mariam Sadaka, Ionut Radu, L. Di Cioccio · 2010 · 15 citations

Engineering, Device Integration, Computer Architecture +22