G. Riou

Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking

Ionut Radu, Didier Landru, G. Gaudin et al. · 2010 · 29 citations

Engineering, Bonding Quality, Mechanical Engineering +17

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

G. Gaudin, G. Riou, Didier Landru et al. · 2010 · 17 citations

Engineering, Interconnect (Integrated Circuits), Surface Preparation +19

Multi-Scale Thickness and Roughness Characterization of Thin Silicon-On-Insulator Films

Pablo Acosta-Alba, Oleg Kononchuk, G. Riou et al. · ECS Journal of Solid State Science and Technology · 2013 · 16 citations

Engineering, Roughness Characterization, Integrated Circuits +17

Infrared transmission study of Pr 2 CuO 4 crystal-field excitations

G. Riou, S. Jandl, M. Poirier et al. · The European Physical Journal B · 2001 · 12 citations

Transition Metal Chalcogenides, Engineering, Pr 2 +9