Tristan A. Tronic

Atomic Layer Etching: An Industry Perspective

C.T. Carver, John J. Plombon, Patricio E. Romero et al. · ECS Journal of Solid State Science and Technology · 2015 · 157 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Process integration and future outlook of 2D transistors

Kevin O’Brien, Carl H. Naylor, C. J. Dorow et al. · Nature Communications · 2023 · 130 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Advancing 2D Monolayer CMOS Through Contact, Channel and Interface Engineering

C. J. Dorow, Ashish Verma Penumatcha, K. Maxey et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 112 citations

Engineering, Electrical Engineering, Materials Science +17

Using combinations of oxidants and bases as PCET reactants: thermochemical and practical considerations

Christopher R. Waidmann, Alexander J. M. Miller, Cheuk-Wa Angela Ng et al. · Energy & Environmental Science · 2012 · 111 citations

Natural Sciences, Chemical Engineering, Chemistry +15

3D heterogeneous integration of high performance high-K metal gate GaN NMOS and Si PMOS transistors on 300mm high-resistivity Si substrate for energy-efficient and compact power delivery, RF (5G and beyond) and SoC applications

Han Wui Then, Changyang Huang, B. Krist et al. · 2019 · 103 citations

Engineering, Electrical Engineering, Materials Science +17