Chin-Sung Chung

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Publications

Citations

154

H-Index

Active since

2012

Affiliations

Seoul National University of Science and Technology(Current)

Chin-Sung Chung is an author at Seoul National University of Science and Technology specializing in materials engineering, materials science, and materials characterization.

Publications per year

2012–2015

Publications

Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

L.C. Tsao, Chia-Wei Huang, Chin-Sung Chung et al. · Materials Science and Engineering A · 2012 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +16

The tensile impact properties of aged Sn–3Ag–0.5Cu/Cu solder joints

Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim · Microelectronics Reliability · 2015 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +13

Comparison of the fracture toughness of Cu6Sn5 intermetallic compound as measured by nanoindentation and other methods

Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim · Materials Letters · 2015 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +13

Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging

Van Luong Nguyen, Chin-Sung Chung, Ho-Kyung Kim · Journal of Electronic Materials · 2015 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +12

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