Concepedia

Masayoshi Shimoda

MS

Statistics

Publications

4

Citations

144

H-Index

4

Active since

2006

Affiliations

Fuji Electric (Japan)(Current)

Masayoshi Shimoda is an author at Fuji Electric (Japan) specializing in mechanical engineering, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceMechanical EngineeringMicrostructureMaterials EngineeringMechanical PropertiesCorrosionSolidificationApplied PhysicsStructural Materials

Publications per year

2006–2016

4

Publications

4

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Tomohiro Yamakawa, Tadashi Takemoto, Masayoshi Shimoda et al. · Journal of Electronic Materials · 2013 · 106 citations

Materials Science, Materials Engineering, Friction Welding +5

Effect of Addition Elements on Creep Properties of the Sn-Ag-Cu Lead Free Solder

Megumi Nagano, Noboru Hidaka, Hirohiko Watanabe et al. · Journal of The Japan Institute of Electronics Packaging · 2006 · 14 citations · Full text

Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder

Haidong Zhang, Ikuo Shohji, Masayoshi Shimoda et al. · MATERIALS TRANSACTIONS · 2016 · 13 citations · Full text

Engineering, Mechanical Engineering, Strain Rate +19

Effects of Ag Content on the Mechanical Properties of Bi-Ag Alloys Substitutable for Pb based Solder

Masayoshi Shimoda, Tomohiro Yamakawa, Kunio Shiokawa et al. · OUKA (Osaka University Knowledge Archive) (Osaka University) · 2012 · 11 citations

Materials Science, Materials Engineering, Bi-ag Alloys Substitutable +14

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