Kunio Shiokawa

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Tomohiro Yamakawa, Tadashi Takemoto, Masayoshi Shimoda et al. · Journal of Electronic Materials · 2013 · 106 citations

Materials Science, Materials Engineering, Friction Welding +5

Development of a high-power blue laser (445  nm) for material processing

Hongze Wang, Yousuke Kawahito, Ryohei Yoshida et al. · Optics Letters · 2017 · 101 citations

Laser Processing (Laser Material Processing), Engineering, Mechanical Engineering +17

Effect of chloride and sulfate ions on crevice corrosion behavior of low-pressure steam turbine materials

Li-Bin Niu, Kōji Okano, Sakae Izumi et al. · Corrosion Science · 2017 · 36 citations

Materials Science, Corrosion Protection, Engineering +6

Crack Propagation Behaviour of Four Types of Lead and Lead-Free Solders in Push-Pull Low Cycle Fatigue.

Haruo Nose, Masao Sakane, Mitsuo Yamashita et al. · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A · 2002 · 19 citations · Full text

Materials Science, Crack Propagation Tests, Engineering +13

Multiaxial Low Cycle Fatigue of Five Kinds of Solders.

Takaei YAMAMOTO, Masao Sakane, Masateru OHNAMI et al. · Journal of the Society of Materials Science Japan · 1997 · 11 citations · Full text

Materials Science, Five Kinds, Fatigue Management +14