Tim Tri Hoang

TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O

Mark T. Wade, Erik Anderson, Shahab Ardalan et al. · IEEE Micro · 2020 · 138 citations

Optical Materials, Engineering, Device Integration +20

Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration

Ahmet C. Durgun, Zhiguo Qian, Kemal Aygün et al. · 2019 · 25 citations

Engineering, Vlsi Design, Device Integration +17

5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O

Kaveh Hosseini, Edwin Kok, Sergey Shumarayev et al. · 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 22 citations

Optical Materials, Engineering, Device Integration +21

Scalable architecture for sub-pJ/b multi-Tbps comb-driven DWDM silicon photonic transceiver

Yuyang Wang, Asher Novick, Robert Parsons et al. · 2023 · 19 citations

Novel Transceiver Architecture, Engineering, Integrated Photonics +17

Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity

Yuyang Wang, Songli Wang, Robert Parsons et al. · 2024 · 14 citations