Yufei Gao

Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw

Peizhi Wang, Peiqi Ge, Yufei Gao et al. · Materials Science in Semiconductor Processing · 2017 · 87 citations

Engineering, Materials Engineering, Materials Science +10

Experiment study on electroplated diamond wire saw slicing single-crystal silicon

Yufei Gao, Peiqi Ge, Tengyun Liu · Materials Science in Semiconductor Processing · 2016 · 74 citations

Engineering, Materials Engineering, Materials Science +10

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

Tengyun Liu, Peiqi Ge, Wenbo Bi et al. · Materials Science in Semiconductor Processing · 2016 · 66 citations

Engineering, Materials Engineering, Materials Science +16

Nucleation location and propagation direction of radial and median cracks for brittle material in scratching

Xinying Li, Yufei Gao, Peiqi Ge et al. · Ceramics International · 2019 · 64 citations

Engineering, Materials Engineering, Materials Science +14

Experiment and theoretical prediction for surface roughness of PV polycrystalline silicon wafer in electroplated diamond wire sawing

Xinying Li, Yufei Gao, Youkang Yin et al. · Journal of Manufacturing Processes · 2019 · 64 citations

Engineering, Materials Engineering, Materials Science +16