Peiqi Ge

Evolution of deformation mechanisms of Ti–22.4Nb–0.73Ta–2Zr–1.34O alloy during straining

Yi Yang, Shuangshuang Wu, G.P. Li et al. · Acta Materialia · 2010 · 223 citations

Materials Science, Engineering, Severe Plastic Deformation +4

From the microscopic interaction mechanism to the grinding temperature field: An integrated modelling on the grinding process

Jingliang Jiang, Peiqi Ge, Shufeng Sun et al. · International Journal of Machine Tools and Manufacture · 2016 · 86 citations

Materials Science, Engineering, Industrial Engineering +10

Grain trajectory and grain workpiece contact analyses for modeling of grinding force and energy partition

Dexiang Wang, Peiqi Ge, Wenbo Bi et al. · The International Journal of Advanced Manufacturing Technology · 2013 · 85 citations

Grain Workpiece Contact, Engineering, Mechanics +10

Experiment study on electroplated diamond wire saw slicing single-crystal silicon

Yufei Gao, Peiqi Ge, Tengyun Liu · Materials Science in Semiconductor Processing · 2016 · 74 citations

Materials Engineering, Materials Science, Electrical Engineering +4

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

Tengyun Liu, Peiqi Ge, Wenbo Bi et al. · Materials Science in Semiconductor Processing · 2016 · 64 citations

Materials Science, Materials Engineering, Subsurface Crack Damage +11