Yoo-Sun Kim

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Active since

2012

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Yoo-Sun Kim is an author at Korea Advanced Institute of Science and Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingElectrical EngineeringMechanical EngineeringElectrical InsulationMechanics Of MaterialsUltrasoundMicroelectronicsFlexible Electronics

Publications per year

2012–2015

Publications

A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Shuye Zhang, Seung‐Ho Kim, Taewan Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 25 citations

Materials Science, Electrical Engineering, Engineering +15

Flux function added solder anisotropic conductive films (ACFs) for high power and fine pitch assemblies

Seung‐Ho Kim, Yongwon Choi, Yoo-Sun Kim et al. · 2013 · 13 citations

Materials Science, Materials Engineering, Electrical Engineering +13

Highly Reliable Solder ACFs FOB (Flex-on-Board) Interconnection Using Ultrasonic Bonding

Yoo-Sun Kim, Shuye Zhang, Kyung‐Wook Paik · Journal of the Microelectronics and Packaging Society · 2015 · 12 citations · Full text

Materials Science, Solder Mp, Friction Welding +15

Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films

Seung‐Ho Kim, Yongwon Choi, Yoo-Sun Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 10 citations

Engineering, Flux Activators, Printed Electronics +17

Effects of ACF Bonding Parameters on ACF Joint Characteristics for High-Speed Bonding Using Ultrasonic Bonding Method

Yoo-Sun Kim, Kiwon Lee, Kyung‐Wook Paik · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 10 citations

Materials Science, Electrical Engineering, Anisotropic Conductive Films +15

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