Concepedia

Taewan Kim

TK

Statistics

Publications

4

Citations

186

H-Index

4

Active since

2006

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Taewan Kim is an author at Korea Advanced Institute of Science and Technology specializing in mechanical engineering, engineering, and soft robotics.

ORCID

Top concepts

Publications per year

2006–2016

4

Publications

4

Adhesion analysis of two-level hierarchical morphology in natural attachment systems for 'smart adhesion'

Bharat Bhushan, Andrei Peressadko, Taewan Kim · Journal of Adhesion Science and Technology · 2006 · 111 citations

, , +16

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Taewan Kim, Tae‐Ik Lee, Yan Pan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 29 citations

, , +17

A Study on the Solder Ball Size and Content Effects of Solder ACFs for Flex-on-Board Assembly Applications Using Ultrasonic Bonding

Shuye Zhang, Seung‐Ho Kim, Taewan Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 25 citations

, , +15

Low Temperature Flex‐on‐Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

Taewan Kim, Kyung-Lim Suk, Sanghoon Lee et al. · Journal of Nanomaterials · 2013 · 21 citations · Full text

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