G. Minamihaba

Self-aligned passivation on copper interconnection durability against oxidizing ambient annealing

Hitoshi Itow, Yasushi Nakasaki, G. Minamihaba et al. · Applied Physics Letters · 1993 · 48 citations

Self-aligned Niobium, Engineering, Oxidation Resistance +17

High performance metal gate MOSFETs fabricated by CMP for 0.1 μm regime

A. Yagishita, Tomohiro Saito, K. Nakajima et al. · 2002 · 34 citations

Materials Science, Semiconductor Technology, Electrical Engineering +13

High-performance CMP Slurry with Inorganic/Resin Abrasive for Al/Low k Damascene

Hiroyuki Yano, Yukiteru Matsui, G. Minamihaba et al. · MRS Proceedings · 2001 · 23 citations

Materials Engineering, Materials Science, Chemical Engineering +6

High Performance Ultra Low-k (k=2.0/keff=2.4)/Cu Dual-Damascene Interconnect Technology with Self-Formed MnSixOy Barrier Layer for 32 nm-node

T. Usui, Kazunobu Tsumura, H. Nasu et al. · 2006 · 11 citations

Engineering, Effective Dielectric Constant, Interconnect (Integrated Circuits) +16

Self-Formed Barrier Technology using CuMn Alloy Seed for Copper Dual-Damascene Interconnect with porous-SiOC/porous-PAr Hybrid Dielectric

Toshiyuki Watanabe, H. Nasu, T. Usui et al. · 2007 · 11 citations

Materials Science, Materials Engineering, Electrical Engineering +15