Stephane Bronckers

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology

Geert Van der Plas, Paresh Limaye, Igor Loi et al. · IEEE Journal of Solid-State Circuits · 2010 · 308 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 52 GHz Phased-Array Receiver Front-End in 90 nm Digital CMOS

Karen Scheir, Stephane Bronckers, Jonathan Borremans et al. · IEEE Journal of Solid-State Circuits · 2008 · 112 citations

Engineering, Communication, Electrical Engineering +17

Design issues and considerations for low-cost 3D TSV IC technology

Geert Van der Plas, Paresh Limaye, A. Mercha et al. · 2010 · 61 citations

Engineering, Computer Engineering, Electrical Engineering +16

A Compact Wideband Front-End Using a Single-Inductor Dual-Band VCO in 90 nm Digital CMOS

Jonathan Borremans, Andrea Bevilacqua, Stephane Bronckers et al. · IEEE Journal of Solid-State Circuits · 2008 · 50 citations

Engineering, Electrical Engineering, Analog Electronics +16

Substrate Noise Coupling Mechanisms in Lightly Doped CMOS Transistors

Stephane Bronckers, Geert Van der Plas, Gerd Vandersteen et al. · IEEE Transactions on Instrumentation and Measurement · 2010 · 15 citations

Engineering, Electrical Engineering, Analog Electronics +16