Concepedia

Hoh Huey Jiun

HH

3

Publications

92

Citations

3

H-Index

2005

Active since

Affiliations

National University of Malaysia(Current)

Hoh Huey Jiun is an author at National University of Malaysia specializing in electronic packaging, mechanical engineering, and microfabrication.

Top concepts

Publications per year

2005–2008

3

Publications

3

Effect of wafer thinning methods towards fracture strength and topography of silicon die

Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar et al. · Microelectronics Reliability · 2005 · 49 citations

, , +13

Effect of Laminated Wafer Toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping

Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2006 · 30 citations

, , +13

Characterization of Flip Chip Bump Failure Mode by using High Frequency 230MHz MP and CP4 Transducer

Hoh Huey Jiun, Zhang Shu, Xue Ming · 2008 · 13 citations

, , +21

Rows per page

1–3 of 3