Paul Wild

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Active since

2017

Affiliations

Hahn-Schickard-Gesellschaft für angewandte Forschung(Current)

Festo (Germany)

University of Stuttgart

Paul Wild is an author at Hahn-Schickard-Gesellschaft für angewandte Forschung specializing in electronic packaging, mechanical engineering, and engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringCorrosionMicrostructureApplied PhysicsSolid MechanicsMaterial ScienceMicroelectronicsMaterials Engineering

Publications per year

2017–2018

Publications

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Paul Wild, Dominik Lorenz, T. Grözinger et al. · Microelectronics Reliability · 2018 · 40 citations

Thermo-mechanical Reliability, Electrical Engineering, Engineering +10

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

Paul Wild, T. Grözinger, Dominik Lorenz et al. · IEEE Transactions on Reliability · 2017 · 25 citations

Engineering, Mechanical Engineering, Lead-free Solder Alloys +16

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