Taehoon Cheon

Enhanced activity of highly conformal and layered tin sulfide (SnSx) prepared by atomic layer deposition (ALD) on 3D metal scaffold towards high performance supercapacitor electrode

Mohd Zahid Ansari, Nazish Parveen, Dip K. Nandi et al. · Scientific Reports · 2019 · 101 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Atomic Layer Deposition of Ru for Replacing Cu-Interconnects

Yohei Kotsugi, Seung‐Min Han, Youn‐Hye Kim et al. · Chemistry of Materials · 2021 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +16

Atomic-Layer-Deposited MoN_<i>x</i> Thin Films on Three-Dimensional Ni Foam as Efficient Catalysts for the Electrochemical Hydrogen Evolution Reaction

Rahul Ramesh, Dip K. Nandi, Tae Hyun Kim et al. · ACS Applied Materials & Interfaces · 2019 · 65 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating

Sang-Hyeok Choi, Taehoon Cheon, Soo‐Hyun Kim et al. · Journal of The Electrochemical Society · 2011 · 60 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Low-Temperature Atomic Layer Deposition of Highly Conformal Tin Nitride Thin Films for Energy Storage Devices

Mohd Zahid Ansari, Dip K. Nandi, Petr Janíček et al. · ACS Applied Materials & Interfaces · 2019 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +17